Fab 9: High-Volume Manufacturing of 3D Advanced Packaging Technologies In New Mexico

Intel celebrated the opening of Fab 9, its cutting-edge #factory in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the #manufacturing of advanced #semiconductor #packaging technologies, including Intel’s breakthrough 3D packaging technology, Foveros, which offers flexible options for combining multiple #chips that are optimized for power, performance and cost.

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Тэги:

#Intel #Technology #Intel_manufacturing #3D_advanced_packaging #high-volume_manufacturing #Intel_New_Mexico #Intel_Foveros

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